Specs
Spi Bay specs
Setup notes and briefing numbers for Spi Bay.
SPI inspection points on this line
Spi Bay specs focuses on the inspection details relevant to SPI equipment in an SMT production flow. It helps a team review the machine fit, line position and process requirements tied to solder paste inspection. This is the technical page for comparing SPI requirements rather than reading a general line summary.
Spi Bay specs sets out the inspection requirements that matter after printing and before placement. It covers pad coverage, paste height, area tolerance and offset checks so a team can judge whether the SPI unit suits the board mix being built in South Africa. On fine pitch work, these checks help separate machine capability from ordinary stencil or paste issues.
Line position matters here because SPI must read paste deposits before vibration, handling or delay changes the result. Record board support method, conveyor width range and fiducial condition during setup, then note any lighting or camera limits seen on dark solder masks. Those details are often more useful than a generic machine summary when scrap starts climbing.
What the specs page covers
Compare inspection resolution, measurement output and pass fail rules for the Spi Bay stage. Capture recipe items such as tolerance bands, warning limits and operator checks linked to first article approval. For mixed production, include whether the SPI system copes well with small runs and frequent changeovers.
Check this spec set against the upstream printer and the downstream placement sequence before changing the process window. Add board thickness, stencil data and the fault pattern seen at SPI if you send details through the contact form. A clear note on bridge risk, insufficient paste or repeatable offset gives better technical context than a general query.
- Paste height and area tolerance
- Conveyor width and board support
- Recipe settings tied to board type
South African production conditions
Johannesburg and Pretoria sites often deal with dust that settles on transport rails, lenses and exposed sensors, which can skew repeatability if cleaning slips. Durban and Cape Town plants need closer watch on moisture exposure, paste handling and storage discipline before SPI results are treated as process truth. Read the specs with those site conditions in mind, not as an isolated machine sheet.
Power interruptions change how teams capture first board data and when recipe verification is repeated after restart. Older factories may also have line layouts with limited access around the printer and SPI bay, which affects maintenance and board handling. Include those constraints when comparing a machine fit for an existing SMT line.
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Information to gather for SPI review
Bring the board size range, smallest aperture detail and the paste defects seen on recent builds. Include stencil thickness, print cycle notes and whether the concern is height, volume, shift or missing deposits.
Log the machine model, software revision and any current tolerance settings used on site. Keep them with the line record and board documentation when quality staff need traceable inspection requirements for audit or process review.
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